GLOSSARY

112G

112 gigabit per second connectivity transmission speed for transmission of data

224G   

224 gigabit per second connectivity transmission speed for transmission of data

ASIC   

Application-specific integrated circuit (or system on chip (“SOC”)) that integrates all or most components of a computer or other electronic system

CDR    

Clock-data recovery, component of a connectivity process, which extracts timing information from a serial data stream to allow the receiving circuit to decode the transmitted symbols chiplet smaller modular pieces of silicon, or chiplets, utilised in a design technique to break integrated circuits into smaller pieces that can be individually designed and integrated together using die-to-die interfaces

CPU    

Central processing unit, or microprocessor, of electronic circuitry that executes instructions comprising a programme

CXL     

Compute express link, open standard interconnection for high-speed central processing unit-to-device and CPU-to-memory, for data centres

DSP     

Digital signal processing capabilities, enabled to perform a wide variety of signal processing operations

DRAM

Dynamic random-access memory, semiconductor memory that stores each bit of data in a memory cell consisting of a capacitor and a transistor

FinFET            

Fin field-effect transistor, semiconductor gate design for transmission of information

Form factor     

Design aspect that defines and prescribes the size, shape, and other physical specifications of hardware components

FPGA  

Field programmable gate arrays, an integrated circuit designed to be configured by a customer or a designer after manufacturing

GPU    

Graphics processing unit, the specialised electronic circuit utilised in the creation of images for output to a display device

IAAS   

Infrastructure-as-a-service, comprising the provision of virtualised computing       resources via cloud computing

IDM     

Integrated device manufacturer, a semiconductor company which designs,manufactures and sells integrated circuit product

IEEE    

Institute of Electrical and Electronics Engineers, an electronics industry body, including educational and technical advancement of electrical and electronic engineering, telecommunications, computer engineering and allied disciplines, including standardisation

IoT      

Internet of things, network of physical objects that are embedded with sensors, software and other technologies for the purpose of connecting and exchanging data with other devices and systems over the internet

IP/silicon IP     

Intellectual property core, IP core, or IP block is a reusable unit of logic, cell, or integrated circuit layout design

M2M

Machine-to-machine connectivity, permitting IoT data exchange without human interface or interaction modulation schemes specific technique of signal modulation when converting data into electrical signals for transmission

node   

Technology nodes, or process technologies, referring to the specific semiconductor manufacturing process and its design rules, generally designated by the process’ minimum feature size (in nanometres)

NRE    

Non-recurring engineering, in reference to revenue earned in respect of onetime early-stage customer services including for research, design, development and testing

NVMe

Non-volatile memory interface for accessing external non-volatile storage media utilising PCIe connectivity standard

OEM    

Original equipment manufacturer that produces systems, parts or equipment utilised in the production of another device or product

OIF      

Optical Internetworking Forum, an electronics industry body promoting standardisation, including for optical networking products, network processing elements, and component technologies

PAM     

Pulse amplitude modulations, form of signal modulation where the message information is encoded in the amplitude of a series of signal pulses, such as PAM2 (aka NRZ), PAM4, PAM6 and PAM8

PCIe    

PCI-Express, a high-speed serial computer expansion bus standard

PHY    

Physical interface or “physical layer” processor interface in an integrated circuit

PLL     

Phase-locked loop, component of a connectivity block providing a control system that generates an output signal whose phase is related to the phase of an input signal

SerDes

Wired connectivity component to interface between integrated circuits, which converts parallel streams of data (used as connectivity within integrated circuits) to serial streams (used in longer-distance transmission outside chips) and vice versa

SIG     

Special Interest Group, an electronics industry consortium responsible for specifying the Peripheral Component Interconnect, PCI-X, and PCI Express computer buses

SIP      

Silicon in package, format for packaging multiple smaller dies in a SOCs

SOC    

System on chip (or ASIC) that integrates all or most components of a computer or other electronic system

Tier-1

Semiconductor and component manufacturers that supply parts or systems directly to OEMs

Wafer

In the fabrication of integrated circuits, the thin slice of semiconductor (such as a crystalline silicon) in and upon which microelectronic devices are built